Strain/Stress and Vibration

3D-ESPI System Q-300 TCT

Q-300 ESPI head mounted to a bracket


Thermal Expansion Measurement
- Characterization of electronic components and determination of CTE

The 3D electronic speckle interferometry is a very powerful tool to investigate the thermal expansion of MEMS and electronic components.
Due to the full field measuring technique, combined with a high resolution the determination of critical areas and hot spots in electronic components is very easy.

The 3D-ESPI System Q-300 TCT is designed for complete three dimensional and highly sensitive thermal expansion measurement and strain analysis of materials and components.

  • Full field, 3-dimensional measurement without contact and marking
  • Delivers CTE and thermal strain
  • Measurement of electronic components and materials

Non-contact, full-field and 3D-Analysis on nearly any Material

Q-300 TCT has successfully been used in development and testing of complex (anisotropic) materials, components and structures in electronic applications. It is ideal for the experimental verification of analytical and numerical calculations.
The 3D information enables fast determination of the thermal expansion coefficient of materials as well of the thermal stress of components such as printed circuits, BGA, Flip Chip’s, etc.

tl_files/contents/products/strain-and-stress-measurement/q-300-tct/2.jpg tl_files/contents/products/strain-and-stress-measurement/q-300-tct/3.JPG tl_files/contents/products/strain-and-stress-measurement/q-300-tct/4.jpg tl_files/contents/products/strain-and-stress-measurement/q-300-tct/5.jpg
Flipchip Assembly (1cm x 1cm) BGA with detected de-bonding Thermal expansion of o Flipchip with perfect bonding (left) and defect bonding (right)

The Q-300 TCT system is fully equipped with a heating device, control electronic and a 3D-ESPI sensor on an adjustable support.
Due to the optional use of a contour module the Q-300 TCT could not only be applied to flat surfaces, but also to curved surfaces. 

The sensor is driven by a robust electronic control system with the complete software package ISTRA.
The temperature is acquired at each measuring step. It offers automatic or manual measurement, and quantitative data analysis of 3D displacement and thermal strain fields.

Sub-micrometer accuracy is achieved depending on the geometrical set-up. Maximum measuring accuracy is guaranteed by taking into account the varying sensitivity with different object coordinates. Therefore, the complete geometry matrix is recalculated automatically by ISTRA for Windows® for every object point.

Technical Data

Measuring Sensitivity: 0.01 - 0.1 µm adjustable
Measuring Range: Adjustable to any measurement range by variation of measurement steps
(10 - 100 μm per step depending on measuring direction) 
Measuring area: 40 x 50 mm² down to 0.7 x 1 mm²
Operation modes: automatic, manual, 1D-, 2D-, 3D-operation
Data interface TIFF, ASCII
Data acquisition speed: 3.5 seconds for 3D analysis
Data analysis: automatic serial analysis or manual at any measurement step
Dimensions of sensor head: 80 x 130 x 120 mm³
Dimension of heating device: 200 x 200 x 70 mm³
Laser (built-in): Laserdiode, 70 mW, 785nm
Processor: Portable PC with integrated electronics, heating control with timer 
Operating system: Windows 2000, XP
Heating Specification: Max. temperature: 300 °C. Heating rate: 30 °C per minute. Heating power: 200 W
Mode of operation Manual or ramp heating. Manual or automatic (timer controlled) measurement


  • Contour measurement for thermal strain analysis on curved structures
  • Different lenses for variable field of views
  • Optical table


Product flyer:
Q-300 TCT True Full-Field Measurement of Thermal Expansion on Electronic Components
Strain / stress measurement:
Thermal Expansion of Ball Grid Arrays
Thermal Expansion of Electronic Components
Non Destructive Control of Flip Chip Packages